emSTAMP-MX93
Solder-on module emSTAMP-MX93 with iMX9352CVV from NXP
Do you have growing requirements in terms of real-time capability and energy efficiency?
The emSTAMP-MX93 module fulfils all these requirements.
The module is based on the iMX9352CVV microprocessor from NXP and has a long-term availability of 10 years.
Key features:
- Microcontroller iMX9352CVV from NXP
- ARMĀ® Dual Cortex-A55 @ 1.7 GHz, ARMĀ® Cortex-M33 @ 250 MHz, Neural Processing Unit
- 2 GByte LPDDR4X SDRAM
- 8 GByte eMMC
- Display via MIPI DSI, LVDS, RG
- Camera via MIPI CSI
- 2 * RGMII, USB2.0 host and device, 2 * CAN-FD, SAT
- Solder connection via 116 edge contacts with 1 mm pitch
and 37 contacts on the underside - Supply voltage: 5V
- Size: 33.3 mm x 33.3 mm x 2.7 mm
- Temperature range: -20…+70Ā°C
- Long-term availability 10 years
Functions
CPU Manufacturer
STMicroelectronics
CPU Cores
1
CPU Name
STM32F769
CPU Type
Cortex-MX7
CPU Clock
216 MHz
NOR-Flash
1 - 16 MB
SDRAM
8 - 32 MB
SAI (Serial Audio Interface)
1 x
LCD Interface (RGB18)
1 x
CAN LVTTL
1 x
SPI Interface
2 x
MMC/SDC Interface
1 x
UART LVTTL
1 x
IĆĀ²C Interface
1 x
Ethernet 100BASE-TX
1 x
USB Host 2.0 full speed
1 x
DAC (12bit)
2 x
RTC (battery buffered)
1 x
0 - 70 Ā°C
-40 - 85 Ā°C (extended)
Width
28 mm
Depth
28 mm
Height
3.5 mm
max Power
0.35 A
True
Drivers
novaluefound
Dienste
novaluefound
Release Notes
Known Issues
Article
Article available: novaluefound
Block diagram
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