i.MX53x Module with NXP MCIMX53x
Scalable ARM Cortex-A9 module (SOM/COM) including CPU-bus, camera and 2x CAN
Note: This product is still available for project customers but it is not recommended for new developments!
There is no further development for this product. We would be pleased to continue assisting you in maintaining the software.
Key features:
- NXP (Freescale) processor MCIMX53
- ARM Cortex-A9 processor
- up to 800MHz clock speed
- especially suitable for control tasks
- powerful 2D/3D graphics
- interfaces include: camera, Ethernet, 2x CAN, CPU-bus, and LCD interface
- EtherCAT, PROFINET, CANopen optionally available
- industrial module (COM/ SOM), also available in the extended temperature range
- up to 1GB RAM and up to 1GB NAND flash (SLC)
- scalable and long-term available
- Fastboot optionally available
- IoT capable

Memory
DDR3-SDRAM | 1024 MB | |
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NAND-Flash | 1024 MB |
Connectivity
Ethernet 100BASE-TX | 1 x |
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UART IrDA | 0 x |
UART LVTTL | 4 x |
UART RS232 | 1 x |
USB Device 2.0 high speed | 1 x |
USB Host 2.0 high speed | 1 x |
CAN LVTTL | 1 x |
I²C Interface | 1 x |
SPI Interface | 1 x |
Digital GPIO | 8 x |
MMC/SDC Interface | 2 x |
CPU-Bus | 1 x |
Multimedia
Camera Interface 1 | 1 x |
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SSI Interface for Audio Codec | 1 x |
LCD Interface (RGB) | 1 x |
Camera Interface 2 | 1 x |
LCD Interface (LVDS) | 1 x |
Miscellaneous
RTC (battery buffered) | 1 x |
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Special Functions
CPU performance: up to 1 GHz - 2000 DMIPS | |
Co-Processor: ARM NEON, VFPU | |
Video processing (hardware accelerated): H.264 decode at 1080p30 and H.264 encode at 720p30 | |
2D (Hardware accelerated): openVG 1.1 | |
3D (Hardware accelerated): openGL ES 2.0 & 1.1 (33 Mtri/s, 200 Mpix/s, 800 Mpix/s z-plane), Direct3D Mobile 1.2 |
Supported operating systems
Linux | |
QNX | |
U-Boot | |
Windows |
Power
max Power | 1A |
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Voltage | 3,3V |
Operating temperature
0°C – 70°C | |
-40°C – 85°C (extended) |
Mechanical dimensions
Width | 67,6mm |
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Depth | 50mm |
Height | 10mm |
Name | Summary | File | ||||||
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Windows embedded Compact Kernel Description | Manual of the Developer Kit for Windows embedded Compact 7 |
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DIMM-MX53x Hardware Manual | Hardware manual for DIMM-MX53 modules with i.MX535 and i.MX537 SoCs |
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DIMM-MX53x (Identification Code) |
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DIMM-MX53x (R3B) |
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DIMM-MX53x (R3A) |
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DIMM-MX53x | Errata Sheet |
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DIMM-MX53x (R3C) |
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UART Translation Table | Overview for UART interfaces of CPU modules and baseboards. |
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GPIO Translation Table | GPIO Translation Table for DIMM-Series CPU Modules |
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DIMM-MX53x (R3E) |
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U-Boot for DIMM-MX53-3 | U-Boot (binary file) and Display table on DIMM-MX53 boards with 512 MB RAM |
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Flyer DIMM-MX53 | Flyer of emtrion's DIMM-MX53 Module |
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Name | Summary | ||
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Cadun | DIMM series compliant baseboard for high performance CPU modules | ||
Tarion | DIMM series compliant baseboard for high performance CPU modules including a miniPCIe slot for wireless network extensions. | ||
DIMM-Debug | Debug-Board for emtrion's DIMM series CPU modules. |
Question | |
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Additional Interfaces (DIMM-MX53) Is it possible to use additional interfaces or features, than mentioned in the HW Manual, without a redesign? |
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DIMM-MX537 vs. DIMM-MX535 What is the difference between the DIMM-MX535 and the DIMM-MX537? |
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Not needed pins (DIMM-MX53) How should not needed pins be connected on the baseboard? |
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Ports as PWM (DIMM-MX53) Which ports can be used as PWM output? |
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Power_on_Base Signal (DIMM-MX53) Must the baseboard support the signal POWER_ON_BASE signal? |
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Simultanous use of interfaces (DIMM-MX53) Are there any interfaces on the DIMMMX53x modules which can’t be used simultaneously? |
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Usage of BAT pin (DIMM-MX53) What must be considered if the BAT pin is not supplied by a battery from the baseboard? |
For more information on this product, please visit our SupportNet. For more information on this product, please visit our SupportNet.