emSTAMP-MX93
Solder-on module emSTAMP-MX93 with iMX9352CVV from NXP
Do you have growing requirements in terms of real-time capability and energy efficiency?
The emSTAMP-MX93 module fulfils all these requirements.
The module is based on the iMX9352CVV microprocessor from NXP and has a long-term availability of 10 years.
Key features:
- Microcontroller iMX9352CVV from NXP
- ARM® Dual Cortex-A55 @ 1.7 GHz, ARM® Cortex-M33 @ 250 MHz, Neural Processing Unit
- 2 GByte LPDDR4X SDRAM
- 8 GByte eMMC
- Display via MIPI DSI, LVDS, RG
- Camera via MIPI CSI
- 2 * RGMII, USB2.0 host and device, 2 * CAN-FD, SAT
- Solder connection via 116 edge contacts with 1 mm pitch
and 37 contacts on the underside - Supply voltage: 5V
- Size: 33.3 mm x 33.3 mm x 2.7 mm
- Temperature range: -20…+70°C
- Long-term availability 10 years
Functions
CPUCPU ManufacturerManufacturer
NXP
CPU Cores
2
CPU Name
iMX9352CVV
CPU Type
ARM® Dual Cortex-A55 @ 1.7 GHz, ARM® Cortex-M33 @ 250 MHz, Neural Processing Unit-MX7 -MX7
CPU Clock
1700
eMMC NAND-Flash
8 GB
SDRAM
2 GB
SAI (Serial Audio Interface)
1 x
LCD Interface (DSI)
1 x
Ethernet Gbit
2 x
USB 2.0 Host
1 x
USB 2.0 Device
1 x
CAN LVTTL
2 x
UART LVTTL
6 x
UART LVTTL (mit RTS/CTS)
4 x
SPI Interface
1 x
I²C Interface
2 x
Camera CSI(battery buffered)
1 x
-20 - 70 °C
Width
30 mm
Depth
30 mm
Height
7 mm
Power
0.2 A @ 5 V
True
Drivers
novaluefound
Dienste
novaluefound
Release Notes
Known Issues
Article
Article available: novaluefound
Block diagram
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